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1 features ? low-voltage and standard-voltage operation ? 5.0 (v cc = 4.5v to 5.5v) ? 2.7 (v cc = 2.7v to 5.5v) internally organized 16,384 x 8 and 32,768 x 8 2-wire serial interface schmitt trigger, filtered inputs for noise suppression bi-directional data transfer protocol 1 mhz (5v) and 400 khz (2.7v) compatibility 64-byte page write mode (partial page writes allowed) self-timed write cycle (5 ms typical) high reliability ? endurance: 100,000 write cycles ? data retention: 40 years ? esd protection: > 4000v description the AT24C128SC/256sc provides 131,072/262,144 bits of serial electrically erasable and programmable read only memory (eeprom) organized as 16,384/32,768 words of 8 bits each. the devices are optimized for use in smart card applications where low- power and low-voltage operation may be essential. the devices are available in several standard iso 7816 smart card modules (see ordering information). the entire family is available in both high-voltage (4.5v to 5.5v) and low-voltage (2.7v to 5.5v) versions. all devices are functionally equivalent to atmel serial eeprom products offered in standard ic packages (pdip, soic, eiaj, lap), with the exception of the slave address and write protect functions which are not required for smart card applications. pin configurations card module contact pad name description iso module contact vcc power supply voltage c1 gnd ground c5 scl serial clock input c3 sda serial data input/output c7 nc no connect c2, c4, c6, c8 vcc nc 2-wire serial eeprom smart card modules 128k (16,384 x 8) 256k (32,768 x 8) AT24C128SC at24c256sc rev. 1661a ? 10/00
AT24C128SC/256sc 2 block diagram pin description serial clock (scl): the scl input is used to positive edge clock data into each eeprom device and negative edge clock data out of each device. serial data (sda): the sda pin is bidirectional for serial data transfer. this pin is open-drain driven and may be wire-ored with any number of other open-drain or open-collector devices. memory organization AT24C128SC/256sc, 128k/256k serial eeprom: the 128k/256k is internally organized as 256/512 pages of 64- bytes each. random word addressing requires a 14/15-bit data word address. absolute maximum ratings* operating temperature.................................. -55 c to +125 c *notice: stresses beyond those listed under ? absolute maximum ratings ? may cause permanent dam- age to the device. this is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. storage temperature ..................................... -65 c to +150 c voltage on any pin with respect to ground .....................................-1.0v to +7.0v maximum operating voltage .......................................... 6.25v dc output current........................................................ 5.0 ma
AT24C128SC/256sc 3 note: this parameter is characterized and is not 100% tested. note: 1. v il min and v ih max are reference only and are not tested pin capacitance (1) applicable over recommended operating range from t a = 25 c, f = 1.0 mhz, v cc = +2.7v. symbol test condition max units conditions c i/o input/output capacitance (sda) 8 pf v i/o = 0v c in input capacitance (scl) 6 pf v in = 0v dc characteristics applicable over recommended operating range from: t ac = 0 c to +70 c, v cc = +2.7v to +5.5v (unless otherwise noted). symbol parameter test condition min typ max units v cc1 supply voltage 2.7 5.5 v v cc2 supply voltage 4.5 5.5 v i cc1 supply current v cc = 5.0v read at 400 khz 1.0 2.0 ma i cc2 supply current v cc = 5.0v write at 400 khz 2.0 3.0 ma i sb1 standby current (2.7v option) v cc = 2.7v v in = v cc or gnd 0.5 a v cc = 5.5v 6.0 i sb2 standby current (5.0v option) v cc = 4.5 - 5.5v v in = v cc or gnd 6.0 a i li input leakage current v in = v cc or gnd 0.10 3.0 a i lo output leakage current v out = v cc or gnd 0.05 3.0 a v il input low level (1) -0.6 v cc x 0.3 v v ih input high level (1) v cc x 0.7 v cc + 0.5 v v ol output low level v cc = 3.0v i ol = 2.1 ma 0.4 v
AT24C128SC/256sc 4 notes: 1. this parameter is characterized and is not 100% tested. 2. ac measurement conditions: r l (connects to v cc ): 1.3 k ? (2.7v, 5v), input pulse voltages: 0.3v cc to 0.7v cc input rise and fall times: 50ns input and output timing reference voltages: 0.5v cc device operation clock and data transitions: the sda pin is nor- mally pulled high with an external device. data on the sda pin may change only during scl low time periods (refer to data validity timing diagram). data changes during scl high periods will indicate a start or stop condition as defined below. start condition: a high-to-low transition of sda with scl high is a start condition which must precede any other command (refer to start and stop definition timing dia- gram). stop condition: a low-to-high transition of sda with scl high is a stop condition. after a read sequence, the stop command will place the eeprom in a standby power mode (refer to start and stop definition timing diagram). acknowledge: all addresses and data words are seri- ally transmitted to and from the eeprom in 8-bit words. the eeprom sends a zero during the ninth clock cycle to acknowledge that it has received each word. standby mode: the AT24C128SC/256sc features a low power standby mode which is enabled: a) upon power- up and b) after the receipt of the stop bit and the comple- tion of any internal operations. memory reset: after an interruption in protocol, power loss or system reset, any 2-wire part can be reset by follow- ing these steps: 1. clock up to 9 cycles. 2. look for sda high in each cycle while scl is high. 3. create a start condition as sda is high. ac characteristics applicable over recommended operating range from t a = 0 c to +70 c, v cc = +2.7v to +5.5v, cl = 100 pf (unless other- wise noted). test conditions are listed in note 2. symbol parameter 2.7-volt 5.0-volt units min max min max f scl clock frequency, scl 400 1000 khz t low clock pulse width low 1.3 0.6 s t high clock pulse width high 1.0 0.4 s t aa clock low to data out valid 0.05 0.9 0.05 0.55 s t buf time the bus must be free before a new transmission can start (1) 1.3 0.5 s t hd.sta start hold time 0.6 0.25 s t su.sta start set-up time 0.6 0.25 s t hd.dat data in hold time 0 0 s t su.dat data in set-up time 100 100 ns t r inputs rise time (1) 0.3 0.3 s t f inputs fall time (1) 300 100 ns t su.sto stop set-up time 0.6 0.25 s t dh data out hold time 50 50 ns t wr write cycle time 10 10 ms endurance (1) 5.0v, 25 c, page mode 100k 100k write cycles
AT24C128SC/256sc 5 bus timing scl: serial clock, sda: serial data i/o write cycle timing scl: serial clock, sda: serial data i/o note: 1. the write cycle time t wr is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. t wr (1)
AT24C128SC/256sc 6 data validity start and stop definition output acknowledge
AT24C128SC/256sc 7 device addressing the 128k/256k eeprom requires an 8-bit device address word following a start condition to enable the chip for a read or write operation (refer to figure 1). the device address word consists of a mandatory one, zero sequence for the first four most significant bits as shown. this is common to all 2-wire eeprom devices. the next three bits of the device address word are unused. these three unused bits should be set to ? 0 ? . the eighth bit of the device address is the read/write opera- tion select bit. a read operation is initiated if this bit is high and a write operation is initiated if this bit is low. upon a compare of the device address, the eeprom will output a zero. if a compare is not made, the device will return to a standby state. write operations byte write: a write operation requires two 8-bit data word addresses following the device address word and acknowledgment. upon receipt of this address, the eeprom will again respond with a zero and then clock in the first 8-bit data word. following receipt of the 8-bit data word, the eeprom will output a zero. the addressing device, such as a microcontroller, then must terminate the write sequence with a stop condition. at this time the eeprom enters an internally-timed write cycle, t wr , to the nonvolatile memory. all inputs are disabled during this write cycle and the eeprom will not respond until the write is complete (refer to figure 2). pag e w r it e: the 128k/256k eeprom is capable of 64- byte page writes. a page write is initiated the same way as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. instead, after the eeprom acknowledges receipt of the first data word, the microcon- troller can transmit up to 63 more data words. the eeprom will respond with a zero after each data word received. the microcontroller must terminate the page write sequence with a stop condition (refer to figure 3). the data word address lower six bits are internally incre- mented following the receipt of each data word. the higher data word address bits are not incremented, retaining the memory page row location. when the word address, inter- nally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. if more than 64 data words are transmitted to the eeprom, the data word address will ? roll over ? and previous data will be overwritten. the address ? roll over ? during write is from the last byte of the current page to the first byte of the same page. acknowledge polling: once the internally-timed write cycle has started and the eeprom inputs are dis- abled, acknowledge polling can be initiated. this involves sending a start condition followed by the device address word. the read/write bit is representative of the operation desired. only if the internal write cycle has completed will the eeprom respond with a zero, allowing the read or write sequence to continue. read operations read operations are initiated the same way as write opera- tions with the exception that the read/write select bit in the device address word is set to one. there are three read operations: current address read, random address read and sequential read. current address read: the internal data word address counter maintains the last address accessed dur- ing the last read or write operation, incremented by one. this address stays valid between operations as long as the chip power is maintained. the address ? roll over ? during read is from the last byte of the last memory page, to the first byte of the first page. once the device address with the read/write select bit set to one is clocked in and acknowledged by the eeprom, the current address data word is serially clocked out. the microcontroller does not respond with an input zero but does generate a following stop condition (refer to figure 4). random read: a random read requires a ? dummy ? byte write sequence to load in the data word address. once the device address word and data word address are clocked in and acknowledged by the eeprom, the microcontroller must generate another start condition. the microcontroller now initiates a current address read by sending a device address with the read/write select bit high. the eeprom acknowledges the device address and serially clocks out the data word. the microcontroller does not respond with a zero but does generate a following stop condition (refer to figure 5). sequential read: sequential reads are initiated by either a current address read or a random address read. after the microcontroller receives a data word, it responds with an acknowledge. as long as the eeprom receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. when the memory address limit is reached, the data word address will ? roll over ? and the sequential read will con- tinue. the sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (refer to figure 6).
AT24C128SC/256sc 8 figure 1. device address figure 2. byte write figure 3. page write notes: 1. * = don ? t care bit 2. ? = don ? t care bit for the 128k
AT24C128SC/256sc 9 figure 4. current address read figure 5. random read notes: 1. * = don ? t care bit 2. ? = don ? t care bit for the 128k figure 6. sequential read
AT24C128SC/256sc 10 AT24C128SC ordering information note: formal drawings may be obtained from an atmel sales office. ordering code package (1) voltage range temperature range AT24C128SC - 09at - 2.7 AT24C128SC - 09bt - 2.7 AT24C128SC - 09ct - 2.7 AT24C128SC - 09dt - 2.7 m2 - a module m2 - b module m4 - c module m4 - d module 2.7v to 5.5v commercial (0 c to 70 c) AT24C128SC - 09at AT24C128SC - 09bt AT24C128SC - 09ct AT24C128SC - 09dt m2 - a module m2 - b module m4 - c module m4 - d module 4.5v to 5.5v commercial (0 c to 70 c) at24c256sc ordering information ordering code package (1) voltage range temperature range at24c256sc - 09at - 2.7 at24c256sc - 09bt - 2.7 at24c256sc - 09ct - 2.7 at24c256sc - 09dt - 2.7 m2 - a module m2 - b module m4 - c module m4 - d module 2.7v to 5.5v commercial (0 c to 70 c) at24c256sc - 09at at24c256sc - 09bt at24c256sc - 09ct at24c256sc - 09dt m2 - a module m2 - b module m4 - c module m4 - d module 4.5v to 5.5v commercial (0 c to 70 c) package type (1) m2 - a module m2 iso 7816 smart card module m2 - b module m2 iso 7816 smart card module with atmel logo m4 - c module m4 iso 7816 smart card module m4 - d module m4 iso 7816 smart card module with atmel logo
AT24C128SC/256sc 11 smart card modules m2 - a module - ordering code: 09at module size: m2 dimension (1) : 12.6 x 11.4 mm glob top: square: 8.6 x 8.6 mm thickness: 0.58 mm max. pitch: 14.25 mm m2 - b module - ordering code: 09bt module size: m2 dimension (1) : 12.6 x 11.4 mm glob top: square: 8.6 x 8.6 mm thickness: 0.58 mm max. pitch: 14.25 mm m4 - c module - ordering code: 09ct module size: m4 dimension (1) : 12.6 x 12.6 mm glob top: square: 8.6 x 8.6 mm thickness: 0.58 mm pitch: 14.25 mm m4 - d module - ordering code: 09dt module size: m4 dimension (1) : 12.6 x 12.6 mm glob top: square: 8.6 x 8.6 mm thickness: 0.58 mm max. pitch: 14.25 mm note: 1. the module dimensions listed refer to the dimensions of the exposed metal contact area. the actual dimensions of the module after excise or punching from the carrier tape are generally 0.4 mm greater in both directions (i.e. a punched m2 module will yield 13.0 x 11.8 mm).
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